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| U832BS / U834BS 3-GHz Frequency Divider Description U832BS and U834BS use TEMIC's advanced bipolar process. RF input can be driven differential as well as single ended. Low current consumption makes the device suitable for mobile application. D U832BS divides by 2 D U834BS divides by 4 D Very low current consumption (typically 12 mA) D 3-GHz maximum operating frequency D Supply voltage, typically 5 V D ESD protection in accordance with MIL-STD. 883 method 3015 class 2 Benefits D Extended operation time due to very low current consumption D Only three external components D Low RF input level reduces radiation problems Block Diagram V S 8 2 RFi 3 6 2 4 GND 2 (only U834BS) 2.3 k W 2.3 kW 1,5 N.C RFo 7 93 7783 e Figure 1. Block diagram Ordering Information Extended Type Number U832BS-FP U834BS-FP Package SO8 SO8 Remarks TELEFUNKEN Semiconductors Rev. A2, 27-Jan-97 1 (6) U832BS / U834BS Pin Description Pin 1 2 3 4 5 6 7 8 Symbol NC RFi RFi GND NC RFO RFO VS Function Not connected RF input RF input with internal decoupling capacitor Ground Not connected Output Output Supply voltage NC RFi RFi GND 1 2 3 4 94 7836 e 8 7 6 5 VS RFO RFO NC Absolute Maximum Ratings Parameters Supply voltage Pin 8 Input voltage range Pins 2 and 3 Junction temperature Storage temperature range Symbol VS Vi Tj Tstg Value 6 0 to VS 125 - 40 to + 125 Unit V V C C Operating Range Parameters Supply voltage range Ambient temperature range Symbol VS Tamb Value 4.5 to 5.5 - 25 to + 85 Unit V C Thermal Resistance Junction ambient Parameters SO8 Symbol RthJA Value 175 Unit K/W 2 (6) TELEFUNKEN Semiconductors Rev. A2, 27-Jan-97 U832BS / U834BS Electrical Characteristics VS = 4.5 to 5.5 V, Tamb = 0 to + 70C, referred to test circuit, unless otherwise specified. Parameters Supply current Test Conditions / Pin VS = 5 V Pin 8 U832BS (: 2) U834BS (: 4) Pin 2 RS = 50 W RS = 50 W Pin 2 Pins 6 and 7 R6, R7 = R6, R7 = 1 K Symbol IS Min Typ 12 13 RFi ViRF fimin fimax RFO VRFo 80 3000 -8 -5 Max 16 17.5 300 300 Unit mA mA mV MHz RF Input Input sensitivity 1) Input frequency range RF output Output level DC output level VS = 5 V, RL = 50 W, R RL 10 kW VS = 5 V High Low w dBm RFDCH RFDCL 3.6 3.1 V V 1) RMS-voltage calculated from the measured available power. RS = System resistance, RL = Load resistance Output Stage 94 7882 Input Sensitivity vs. Frequency 1000 Rs = 50 W, Vs = 5 V Vi ( mV RMS ) R7 7 Output 6 2.3 kW 2.3 kW R6 Guaranteed operating range Tamb = 0 to 70C 100 80 typical values for Tamb = 25 C 10 0 300 1000 2000 3000 4000 1,5 n.c. Figure 2. 94 7848 RFi ( MHz ) Figure 3. TELEFUNKEN Semiconductors Rev. A2, 27-Jan-97 3 (6) U832BS / U834BS Input Impedance S11 j 0.5j 2j 4050 0.2j 3853 3655 3458 5j 0 -0.2j -0.5j 93 7812 e 4 (6) AA AA AA AA AA AA AA AA AA AA AA AA 0. 2 0. 5 3063 2865 1 2 5 2667 2470 2273 2075 1878 1680 1087 1483 1285 693 890 495 -2j -j 3260 1 10 0 297 -5j Figure 4. TELEFUNKEN Semiconductors Rev. A2, 27-Jan-97 U832BS / U834BS Application Master-Slave-D-Flip-Flops (MS-D-FF's) can be used for frequency division by feeding back the inverted output to the data input. Typical for this kind of dividers is a free- running oscillation of the first divider stage. Here, the input sensitivity of the circuit is minimal (see data sheet page 5: input sensitivity vs. frequency). An oscillation frequency of, e.g., 3.5 GHz (related to the input) will result in an output the part number of frequency of 3.5 GHz: 4 = 875 MHz. To indicate this, TEMIC's selfoscillating frequency dividers are ending with "S" (U834BS-AFP). This oscillation is often used for the quality control of ICs: the higher the frequency, the better the performance. It occurs only if the offset voltage of the input transistor pair is below a certain limit. On the other hand, if this oscillation causes problems, e.g., in frequency counters, an external offset may be added. This can simply be done by connecting an ohmic resistor from Pin 3 (RF input) to ground. Using a value of R3 = 47 kW will stop self oscillation without degrading the input sensitivity markly. Smaller values will decrease the sensitivity especially at higher frequencies. V Batt 1 nF 1 100 pF RF input 2 8 470 pF 1 8 3 < 50 k R3 4 U832BS U834BS 7 470 pF 6 2 3 U891BS U893BSE 7 RF output 6 100 pF 5 4 13291 5 Figure 5. Package Information Package SO8 Dimensions in mm 5.00 4.85 1.4 0.4 1.27 3.81 8 5 0.25 0.10 0.2 3.8 6.15 5.85 5.2 4.8 3.7 technical drawings according to DIN specifications 13034 8 5 TELEFUNKEN Semiconductors Rev. A2, 27-Jan-97 5 (6) U832BS / U834BS Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 6 (6) TELEFUNKEN Semiconductors Rev. A2, 27-Jan-97 |
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